Facility for Printed Organic Electronics 


The infrastructure consists of 75 m² office space and a 850m2 cleanroom which houses 5 equipment clusters. The cleanroom is entirely qualified to ISO6 conditions and temperature and humidity are strictly controlled. This guarantees optimal and very constant working conditions.

Cluster 1: Advanced instrumentation for top-down and bottom-up processing

This cluster is equipped for solution processing of organic semiconducting materials in the nano- or micro- structured form. Moreover the equipment allows the integration in various device architectures and system configurations.

Cluster 2: Synthesis and Formulation

This cluster is dedicated to the synthesis and formulation of materials and inks. It consists of a set of chemical synthesis and characterization tools in cleanroom environment.  Next to a focus on high purity new materials, this cluster also provides possibilities for the scaling-up of existing synthesis and formulation processes.

Cluster 3: Ultra High Vacuum systems for thin film deposition, characterization and batch fabrication

The function of this cluster is to obtain a fundamental understanding of organic semiconductors in their purest thin film form, as well as integrated with other materials, organic and/or inorganic. It is also used to fabricate devices by dry batch processes in ultra high vacuum environment and evaluate their performance.

Cluster 4: Electrical, Optical and Spectroscopic Characterization

This cluster is dedicated to the characterization of materials and devices. The equipment allows to study material properties in bulk form, solution, thin film and in several type of device configurations. The focus lays on electrical and optical properties and surface morphology, but rheological properties and elementary analysis also belong to the possibilities.

Cluster 5: Printing Pilots

The 'printing pilots' in this cluster are all capable of sheet-to-sheet printing upto A4 size flexible or rigid substrates. These sheet-to-sheet machines allow relatively low substrate and material consumption while respecting maximum compatibility with roll-to-roll processing.