This ALD system offers an accesible way for atomic layer deposition of metal oxide. Sample up to 8-inch diameter Precursor available: DI water and TMA (others can be installed upon request) Low temperature processing: 180°C max
Cluster 3: Ultra High Vacuum systems for thin film deposition, characterization and batch fabricationTuesday 12 July 2016 by SMAAL Willem. Last update Thursday 21 July 2016The linear transfer line allows to transport substrates from one deposition or measurement system to the other without breaking the vacuum. It has a pressure in the 10 -9 mbar range.
Cluster 3: Ultra High Vacuum systems for thin film deposition, characterization and batch fabricationTuesday 28 June 2016 by SMAAL Willem. Last update Wednesday 20 July 2016This Buchi system allows you to purify the crude product from your chemical reaction in a fast and accurate way. Injection of liquid or solid Crude weight: up to 40g for solid or 140mL for liquid Pressure max: 15 bars Detector with 3 wavelengths between 200 to 850 nm Detector ELSD Cartridge: from 4 to 1500g
Cluster 2: Synthesis and FormulationTuesday 12 July 2016 by skhiev@enscbp.fr. Last update Wednesday 20 July 2016There are 6 chemical fumehoods, conform with strict safety norms and equipped with: nitrogen and argon process gasses pressure regulated (upto 6 bar) primary vacuum (10^-2 mbar) recycled cooling water (10°C)
Cluster 2: Synthesis and FormulationTuesday 28 June 2016 by SMAAL Willem. Last update Wednesday 20 July 2016The EVG101® spin- and spraycoater can be used for the preparation of uniform coatings of either active materials or photoresists. Spray coating works with low viscosity materials, using an ultrasonic atomizer nozzle; it coats even highly irregular surfaces and uses a very small quantity of material. Spin coating is a highly versatile method, tolerant to a large range of different solutions. The...
Cluster 1: Advanced instrumentation for top-down and bottom-up processingTuesday 28 June 2016 by SMAAL Willem. Last update Wednesday 20 July 2016The EVG6200® mask aligner is a classic photolithography tool that has additional UV nanoimprint and microcontact printing capabilities. With the nanoimprint module, nanostructures with feature sizes much smaller than conventional photolithography can be defined. Substrates up to 200 mm in diameter, thickness between 0,1 and 100mm, rigid or flexible. Resolution: ? 1.5 µm, nanoimprint: <50...
Cluster 1: Advanced instrumentation for top-down and bottom-up processingTuesday 28 June 2016 by SMAAL Willem. Last update Wednesday 20 July 2016