This PLASSYS system is designed to perform physical vapor deposition of metal oxide and evaporate metal by E-beam. deposition from 1 to hundreds of nanometers size of the substrate: 100 x 100mm, 15 x 15 mm, can be adapted on request 4 E-beam sources 3 positions of sputtering: 3 target of 3 inch with adjustable tilt 2 target of 2 inch 2 target face to face ion gun for in-situ etching substrate...

This ALD system offers an accesible way for atomic layer deposition of metal oxide. Sample up to 8-inch diameter Precursor available: DI water and TMA (others can be installed upon request) Low temperature processing: 180°C max

The linear transfer line allows to transport substrates from one deposition or measurement system to the other without breaking the vacuum. It has a pressure in the 10 -9 mbar range.

This Buchi system allows you to purify the crude product from your chemical reaction in a fast and accurate way. Injection of liquid or solid Crude weight: up to 40g for solid or 140mL for liquid Pressure max: 15 bars Detector with 3 wavelengths between 200 to 850 nm Detector ELSD Cartridge: from 4 to 1500g

There are 6 chemical fumehoods, conform with strict safety norms and equipped with: nitrogen and argon process gasses pressure regulated (upto 6 bar) primary vacuum (10^-2 mbar) recycled cooling water (10°C)

The EVG101® spin- and spraycoater can be used for the preparation of uniform coatings of either active materials or photoresists. Spray coating works with low viscosity materials, using an ultrasonic atomizer nozzle; it coats even highly irregular surfaces and uses a very small quantity of material. Spin coating is a highly versatile method, tolerant to a large range of different solutions. The...